Exchange: TAI Sector: Technology Industry: Semiconductor Equipment & Materials
-0.29% TWD170.00
America/New_York / 3 mai 2024 @ 01:30
FUNDAMENTALS | |
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MarketCap: | 127 049 mill |
EPS: | 10.64 |
P/E: | 15.98 |
Earnings Date: | Apr 30, 2024 |
SharesOutstanding: | 747.35 mill |
Avg Daily Volume: | 8.50 mill |
RATING 2024-05-03 |
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A |
Buy |
RATINGS | ||
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Rating CashFlow: | Buy | |
Return On Equity: | Strong Buy | |
Return On Asset: | Strong Buy | |
DE: | Buy | |
P/E: | Sell | |
Price To Book: | Sell |
QUARTER GROWTHS | ||||||
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3/22 | 4/22 | 1/23 | 2/23 | 3/23 | 4/23 | |
Revenue | ||||||
Gr.Profit | ||||||
Ebit | ||||||
Asset | ||||||
Debt |
PE RATIO: COMPANY / SECTOR |
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0.71x |
Company: PE 15.98 | sector: PE 22.45 |
PE RATIO: COMPANY / INDUSTRY |
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1.13x |
Company: PE 15.98 | industry: PE 14.19 |
DISCOUNTED CASH FLOW VALUE |
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TWD134.02 (-21.17%) TWD-35.98 |
Date: 2024-05-04 |
Expected Trading Range (DAY) |
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TWD 162.63 - 177.37 ( +/- 4.33%) |
ATR Model: 14 days |
Indicator Signals | |
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RSI 21 | |
SMA | |
Trend | |
Trend 2 | |
Trend 3 | |
MACD |
Volume Signals | |
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Price | TWD170.00 (-0.29% ) |
Volume | 7.03 mill |
Avg. Vol. | 8.50 mill |
% of Avg. Vol | 82.73 % |
Signal 1: | |
Signal 2: |
0 Signals | Accuracy: 0.00% | Accuracy Buy: 0.00% | Accuracy Sell: 0.00%
Avg return buy: 0.00 % | Avg return sell: 0.00 %
$1 invested is now $1.00 or 0.00% since Coming Soon
Date | Signal | @ | Closed | % |
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Powertech Technology Inc., together with its subsidiaries, researches, designs, develops, assembles, manufactures, packages, tests, and sells various integrated circuit (IC) products primarily in Taiwan. It offers packaging and testing services, such as high pin-count thin small outline package, multi-chip packaging (MCP, S-MCP), ball grid array (wBGA, FBGA) IC, solid state drive (SSD), embedded memory (eMMC, eMCP, UFS), DRAM chip-stacking, mobile memory, Package on Package/Package in Package, CMOS image sensor, and fan-out panel level, as well as secured digital memory card (SD, microSD) and USB. The company also provides Quad Flat No-leads, wafer bumping, system-in-package, wafer level chip scale package, flip-chip, copper pillar bump flip chip, electro-magnetic interference shield package, and module and system packaging services; and wafer testing and redistribution layer services. In addition, it is involved in the design, manufacturing, assembly, testing, and sale of semiconductors, as well as investment and wafer probing testing activities. The company also operates in Japan, Singapore, the United States, Europe, China, Hong Kong, Macao, and internationally. Powertech Technology Inc. was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.