The Technical AnalystExchange: TAI Sector: Technology Industry: Semiconductor Equipment & Materials
Tong Hsing Electronic Price, Forecast, Insider, Ratings, Fundamentals & Signals
3.06% TWD151.50
America/New_York / 3 mai 2024 @ 01:30
| FUNDAMENTALS | |
|---|---|
| MarketCap: | 31 672 mill |
| EPS: | 5.44 |
| P/E: | 27.85 |
| Earnings Date: | Jul 29, 2024 |
| SharesOutstanding: | 209.06 mill |
| Avg Daily Volume: | 1.890 mill |
| RATING 2024-05-03 |
|---|
| B+ |
| Neutral |
| RATINGS | ||
|---|---|---|
| Rating CashFlow: | Neutral | |
| Return On Equity: | Neutral | |
| Return On Asset: | Buy | |
| DE: | Neutral | |
| P/E: | Neutral | |
| Price To Book: | Sell |
| QUARTER GROWTHS | ||||||
|---|---|---|---|---|---|---|
| 4/22 | 1/23 | 2/23 | 3/23 | 4/23 | 1/24 | |
| Revenue | ||||||
| Gr.Profit | ||||||
| Ebit | ||||||
| Asset | ||||||
| Debt |
| PE RATIO: COMPANY / SECTOR |
|---|
| 1.24x |
| Company: PE 27.85 | sector: PE 22.45 |
| PE RATIO: COMPANY / INDUSTRY |
|---|
| 1.96x |
| Company: PE 27.85 | industry: PE 14.19 |
| DISCOUNTED CASH FLOW VALUE |
|---|
|
TWD69.02 (-54.44%) TWD-82.48 |
| Date: 2024-05-04 |
| Expected Trading Range (DAY) |
|---|
|
TWD 148.03 - 154.97 ( +/- 2.29%) |
| ATR Model: 14 days |
Live Trading Signals (every 1 min)
10.00
Buy
Last version updated: Fri April 15th, 2022
| Indicator Signals | |
|---|---|
| RSI 21 | |
| SMA | |
| Trend | |
| Trend 2 | |
| Trend 3 | |
| MACD |
| Volume Signals | |
|---|---|
| Price | TWD151.50 (3.06% ) |
| Volume | 6.27 mill |
| Avg. Vol. | 1.890 mill |
| % of Avg. Vol | 331.47 % |
| Signal 1: | |
| Signal 2: |
Today
Last 12 Months
RSI
Last 10 Buy & Sell Signals For 6271.TW
0 Signals | Accuracy: 0.00% | Accuracy Buy: 0.00% | Accuracy Sell: 0.00%
Avg return buy: 0.00 % | Avg return sell: 0.00 %
$1 invested is now $1.00 or 0.00% since Coming Soon
| Date | Signal | @ | Closed | % |
|---|
6271.TW
Tong Hsing Electronic Industries, Ltd. develops, manufactures, and sells micro modules and custom semiconductor packages in Taiwan. The company provides semiconductor micro module assembly, and thick and thin film substrate foundry services. It also offers microelectronic packaging technologies, such as assembly packaging services, backend technology and others, and RF testing services. In addition, the company provides contract manufacturing services for microelectronic packaging and ceramic thick/thin film substrate fabrication. Its products are used in IGBT, high-frequency switching power supply, automotive, aerospace, solar cell component, telecommunication power supply, laser system, high power LED, microwave, semiconductor process equipment, hybrid electric vehicles, computer peripherals, medical and network equipment, and sensor applications. The company was founded in 1974 and is headquartered in Taipei, Taiwan.